Chip interconnect startup Kandou AI raises $225M in funding
Kandou AI Inc., a developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in funding. Bloomberg reported today that the investment values the company at $400 million. The round was backed by Synopsys Inc. and Cadence…
Kandou AI Inc., a developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in funding. Bloomberg reported today that the investment values the company at $4… [+4448 chars]